United Electronics Currently provides turn key assembly to a number of it’s customers. Our capabilities include:
- Lead-free or tin/lead SMT (Surface Mount Technology) and IMT (Insertion Mount Technology) a.k.a. “through-hole” manufacturing SMT capabilities (lead-free or tin/lead)
- From as small 01005 and 0201
- To fine pitch devices such as uBGA, BGA, CSP, QFN, QFP and large packages). 10-12 mil pitch.
- BGA X-RAY
- Different material process capabilities such as Flex Materials, Exotic Materials, Metal Core / Backed Boards, Teflon
- Various conformal coating (silicon, acrylic, urethane etc.).
- Flying probe ICT, functional testing, EEPROM programming.