Capabilities

Everyday Volume Capability
  • Layers (1-12)
  • Lines and Spaces 3mil line / 3mil space
  • Panel Thickness <= 250 mils
  • Controlled Impedance +/- 10%
  • All types of final finish available
  • Blind and Buried Vias
  • Heat Sink Technology
  • High Performance and Emerging Technology Materials
  • Sequential Lamination
  • Conductive and Non-Conductive Via Fill and Planerize
  • BGA
  • Ultra-Fine Pitch

CAM
  • Pre-CAM DRC Analysis
  • CAM-controlled Panelization with DFM
  • Extracted Net-list Comparison
Laminate Type
  • Lead free alternative High Tg laminates:
    – Example, Isola 370HR, 185HR, Iteq 180, Ventec VT47, Grace GA170
  • All Teflon (Rogers, Taconic, Arlon, Nelco)
  • Standard FR4, FR406, FR408, BT, Cyanate Esters
  • Polyimides
  • GETEK ⁄ Megtron ⁄ Nelco-13
  • Ceramic of various types
Copper Cladding
  • Inner layer maximum Cu weight: 4oz
    – Outer layer maximum Cu weight: 8oz
    – Minimum Cu weight :1/4 oz
Multilayer Constructions
  • Minimum core thickness: .003″
  • Maximum layer count: 12
  • Minimum multi-layer thickness: .025″
  • Maximum multi-layer thickness (non-HASL): .250″
  • Maximum multi-layer thickness (HASL): .0170″
  • Blind/buried vias – sequential lamination
  • Design and Verification of impedance control
Etching
  • Minimum conductor width:
    Start Cu Foil weight Internal External
    0.5 oz. .003″ .004″
    1.0 oz. .004″ .005″
    2.0 oz. .005″ .006″
    3.0+ oz. .006″ .007″
  • Minimum feature spacing:
    Start Cu Foil weight Internal External
    0.5 oz. .003″ .004″
    1.0 oz. .005″ .006″
    2.0 oz. .006″ .0075″
    3.0+ oz. .007″ .009″
Drilling & Plating
  • Max. Aspect Ratio: 10 to 1
  • Min. hole size tolerance (plated):+ .003″ Min hole size tolerance (unplated): +.0015″
  • Min. drilled hole size: 6 mil; maximum hole size: 250 mil
  • Min. annular plane clearance of drilled hole: .010″
  • Min. internal pad size to drill hole size: +.012″
  • Min. external pad size to drill hole size: +.010″
Soldermask
  • Spray-coated Photo-imageable solder mask
  • Screened epoxy solder mask
  • Screened UV-curable via plugging
  • Peelable mask with stencil
  • Min. web thickness: .004
  • Min. solder mask clearance : .0025
Via Fill / Via in Pad
  • Conductive
  • Non-Conductive
Final Finish
  • HASL – Hot Air Solder Level
  • Lead Free Hot Air Level
  • ENIG – Electroless Nickel / Immersion Gold
  • Electroless Palladium
  • Electrolytic Hard Gold over Electrolytic Nickel
  • Electrolytic Soft gold and Electrolytic Nickel
  • Immersion Tin
  • Immersion Silver
  • OSP – Organic Solderable Preservative
  • Carbon ink – switch pads
Fabrication
  • Scoring – CNC (jump scoring available); Web Routing: available
  • Edge milling
  • Hard-tool Pierce and /or Blank
  • Edge beveling
  • Minimum slot width:.020″
  • Min. inside radius (milled): .015″
  • Min. Distance of Plated Hole to internal Trace or Plane .0075″
  • Min. Distance of Non-Plated Hole to internal Trace or Plane: Internal: .0075″, External .006″
  • Standard finished Minimum Annular Ring is .001″, if not specified.
  • Min. Pad to Drill Hole Size: Internal .010″, External .008″
  • Min. Plane Clearance to Drill Hole: .020″
  • Min. Drilled Hole Size: .008″
Electrical Test
  • Dual Access Testing – Universal grid
  • Net list Testing (Gerber – extracted/IPC- D-356)
  • Fixtureless Testing for Proto/Small Volume
  • Impedance Testing (Polar CITS-500) Impedance Tolerance: + /- 5%
  • Min. Continuity Test: 10 Ohm
  • Max Isolation Test:10 M Ohm
  • Voltage: 10 – 100 VDC
  • Fine Pitch Testing:
    Min. SMD Pitch (fixtureless): .012″
    Min. BGA Pitch (fixture): 1 mm (.0394)
Aluminum/Brass/Copper Heat Sink Circuits
  • RF Telecommunication (500 MHz to 100 GHz) Complex board shapes fabricated using CNC routing, milling Machining tolerances: ±.005″, down to ±.001″ Aluminum-backed PTFE circuit with nickel and gold plating on both copper circuitry and aluminum
  • Single and double-sided circuits with thermally conducting electrically insulating bonding film between circuitry and heat sink base. Copper circuitry with various Cu thicknesses and final finish can be bonded with Al of various types and thickness. For heat management applications: Power supplies, Automotive electronics including LEDs, Computers, Motor controls, and Power semiconductors