Metal Clad PCBs
UE’s Metal Clad PCB manufacturing delivers high-performance solutions that meet the stringent requirements of various industries. Our capabilities ensure we produce PCBs that are both highly functional and exceptionally durable.
Advanced Materials and Bonding Techniques
Our Metal Clad PCBs are manufactured using both pre-bonded and post-bonded materials, providing flexibility in the production process to suit specific application needs. We utilize a variety of metals, including aluminum, copper, brass, and aluminum composites. These materials are selected to provide optimal thermal and electrical conductivity, as well as mechanical strength.
Innovative Adhesive Bonded Laminates
We offer thermally and electrically conductive, as well as non-conductive, commercially available adhesive-bonded laminates. These laminates enhance the performance and reliability of our PCBs, making them suitable for a wide range of high-performance applications.
Precision Engineering and Machining
Our manufacturing capabilities include precision pocket machining and in-house plating, which ensure high tolerance and quality in finished assemblies. We are also equipped to handle plated through-hole capabilities, connecting metal carriers to PTFE substrates with exceptional reliability.
Diverse PCB Configurations
United Electronic Corp. produces single, double-sided, and multilayer PTFE PCBs. This versatility allows us to accommodate various design and performance requirements, ensuring that we can meet each customer’s unique needs.
Heat Sink Technology and Thin Dielectric Films
Our expertise in heat sink technology ensures that our PCBs can effectively manage heat dissipation, critical for high-power applications. Additionally, we utilize thin dielectric films, which are essential for maintaining signal integrity in high-frequency applications.
Wire Bondable Finishes
We offer wire-bondable finishes, providing compatibility with various assembly processes. This flexibility ensures that our PCBs can seamlessly integrate into different systems and applications.
